I did graduate work in electrochemical engineering and worked on several electrolytic silver recovery projects while at Kodak. Silver plating is very much a diffusion controlled process; the electrolyte at the cathode surface becomes depleted of silver ions and fresh solution must be brought into contact with the cathode surface. Without agitation, your plating current must be limited; even with agitation, as the solution silver content drops, the plating current must be limited.
Originally Posted by Worker 11811
To really investigate the plating rate of process you need to look at a number of variables: silver concentration, pH, cathode surface and area, and agitation and you need to monitor the process by measuring the cathode potential with a reference electrode and high input impedance electrometer.